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  • BSI
    BS EN 62047-13:2012 Semiconductor devices. Micro-electromechanical devices - Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
    Edition: 2012
    $316.70
    / user per year

Description of BS EN 62047-13:2012 2012

This part of IEC 62047 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive strength measurement of microstructures, prepared on a substrate, with width and thickness of 1 μm to 1 mm, respectively.

Micro-sized elements of MEMS devices are made up of laminated fine pattern films on a substrate, which are fabricated by deposition, plating, and/or coating with photolithography. MEMS devices include a large number of interfaces between dissimilar materials, at which delamination occasionally occurs during fabrication or in operation. Combination of the materials at the junction determines the adhesive strength; moreover, defects and residual stress in the vicinity of the interface, which are changing by processing condition, strongly affect the adhesive strength. This standard specifies the adhesive testing method for micro-sized-elements in order to optimally select materials and processing conditions for MEMS devices.

This standard does not particularly restrict test piece material, test piece size and performance of the measuring device, since the materials and size of MEMS device components range widely and testing machine for micro-sized materials has not been generalized.



Standard NumberBS EN 62047-13:2012
TitleSemiconductor devices. Micro-electromechanical devices - Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
StatusDefinitive
Publication Date2012-05-31
Identical National Standard OfIEC 61097-4:2012/AMD1:2016, EN 62047-13:2012, IEC 62047-13:2012
DescriptorsSemiconductor devices, Semiconductor technology, Electromechanical devices, Test equipment, Resonance, Integrated circuits, Bend testing, Test specimens, Fatigue testing, Electronic equipment and components, Thin-film devices, Vibration
ICS31.080.99 Other semiconductor devices
CommitteeEPL/47
ISBN978 0 580 69450 9
PublisherBSI
Pages18

About BSI

BSI Group, also known as the British Standards Institution is the national standards body of the United Kingdom. BSI produces technical standards on a wide range of products and services and also supplies certification and standards-related services to businesses.
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