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  • BSI
    BS EN 61760-3:2010 Surface mounting technology - Standard method for the specification of components for through hole reflow (THR) soldering
    Edition: 2010
    $411.69
    / user per year

Description of BS EN 61760-3:2010 2010

This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology.

The object of this standard is to ensure that components with leads intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requirements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is intended. Further this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole reflow soldering technology.



Standard NumberBS EN 61760-3:2010
TitleSurface mounting technology - Standard method for the specification of components for through hole reflow (THR) soldering
StatusWithdrawn
Publication Date2010-06-30
Withdrawn Date2021-10-12
Replaced ByBS EN IEC 61760-3:2021
Identical National Standard OfEN 61760-3:2010, IEC 61760-3:2010
DescriptorsMarking, Packaging, Surface mounting devices, Soldering, Electronic equipment and components, Cleaning, Integrated circuit technology, Solderability testing, Microassembling, Electrical components, Holes, Integrated circuits
ICS31.190 Electronic component assemblies
CommitteeEPL/501
ISBN978 0 580 63929 6
PublisherBSI
Pages28

About BSI

BSI Group, also known as the British Standards Institution is the national standards body of the United Kingdom. BSI produces technical standards on a wide range of products and services and also supplies certification and standards-related services to businesses.
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