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eLibrary > BS EN 62047-16:2015 Semiconductor devices. Micro-electromechanical devices - Test methods for determining residual stresses of MEMS films. Wafer curvature and cantilever beam deflection methods >

BS EN 62047-16:2015 Semiconductor devices. Micro-electromechanical devices - Test methods for determining residual stresses of MEMS films. Wafer curvature and cantilever beam deflection methods, 2015

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BS EN 62047-16:2015 Semiconductor devices. Micro-electromechanical devices - Test methods for determining residual stresses of MEMS films. Wafer curvature and cantilever beam deflection methods, 2015

30321936-VOR.pdf [Go to Page]
English [Go to Page]
CONTENTS
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Testing methods [Go to Page]
4.1 General
4.2 Wafer curvature method [Go to Page]
4.2.1 General
4.2.2 Test apparatus
4.2.3 Measurement procedures
4.2.4 Reports
4.3 Cantilever beam deflection method [Go to Page]
4.3.1 General
4.3.2 Test apparatus
4.3.3 Measurement procedures
4.3.4 Reports
Bibliography
Figures [Go to Page]
Figure 1 – Schematic drawing of compressive residual stress induced curvature after depositing thin film on substrate
Figure 2 – Scheme for comprehensive residual stress induced curvature
Tables [Go to Page]
Table 1 – Mandatory details for the test of wafer curvature method
Table 2 – Mandatory details for the report of beam deflection method
Français [Go to Page]
SOMMAIRE
AVANT-PROPOS
1 Domaine d'application
2 Références normatives
3 Termes et définitions
4 Méthodes d'essai [Go to Page]
4.1 Généralités
4.2 Méthode de la courbure de la plaquette [Go to Page]
4.2.1 Généralités
4.2.2 Appareil d'essai
4.2.3 Modes opératoires de mesure
4.2.4 Rapports
4.3 Méthode de déviation de poutre en porte-à-faux [Go to Page]
4.3.1 Généralités
4.3.2 Appareil d'essai
4.3.3 Modes opératoires de mesure
4.3.4 Rapports
Bibliographie
Figures [Go to Page]
Figure 1 – Dessin schématique de la courbure induite par la contrainte résiduelle de compression après dépôt de film mince sur le substrat
Figure 2 – Schéma représentant la courbure induite par contrainte résiduelle complète
Tableaux [Go to Page]
Tableau 1 – Détails obligatoires pour l'essai de la méthode de la courbure de la plaquette
Tableau 2 – Détails obligatoires pour le rapport de la méthode de la déviation de poutre [Go to Page]

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BS EN 62047-16:2015 Semiconductor devices. Micro-electromechanical devices - Test methods for determining residual stresses of MEMS films. Wafer curvature and cantilever beam deflection methods, 2015

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