ASTM D5109-99
Historical Standard: ASTM D5109-99 Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
SUPERSEDED (see Active link, below)
ASTM D5109
1. Scope
1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.
1.2 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1.1, 8.1.1, and 11.3.1.
1.3 Metric units are the preferred units for this standard. Inch pound units, where shown, are presented for information only.
1.4 The procedures appear in the following sections:
Procedure Section Referenced Documents 2 Conditioning 4 Dielectric Breakdown Voltage Parallel to Laminations 13 Dimensional Instability 19 Dissipation Factor 14 Flammability Rating Test 16 Flexural Strength, Flatwise at Elevated Temperature 15 Flexural Strength, Flatwise at Room Temperature 15 Oven Blister Test 17 Peel Strength Test at Elevated Temperature 10 Peel Strength Test at Room Temperature 9 Permittivity 14 Pin Holes in Copper Surface 20 Purity of Copper 5 Scratches in Copper Surface 21 Solder Float Test 8 Solvent Resistance 7 Surface Resistivity 11 Volume Resistivity 11 Terminology 3 Thickness ? Thickness Variation 18 Warp or Twist 6 Water Absorption 12
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
ASTM Standards
D150 Test Methods for AC Loss Characteristics and Permittivity (Dielectric Constant) of Solid Electrical Insulation
D229 Test Methods for Rigid Sheet and Plate Materials Used for Electrical Insulation
D257 Test Methods for DC Resistance or Conductance of Insulating Materials
D374 Test Methods for Thickness of Solid Electrical Insulation
D618 Practice for Conditioning Plastics for Testing
D1531 Test Methods for Relative Permittivity (Dielectric Constant) and Dissipation Factor by Fluid Displacement Procedures
D1711 Terminology Relating to Electrical Insulation
D1825 Practice for Etching and Cleaning Copper-Clad Electrical Insulating Materials and Thermosetting Laminates for Electrical Testing
D1867 Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
D3636 Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials
E53 Test Method for Determination of Copper in Unalloyed Copper by Gravimetry
Other Standard
NEMAPublicationNumbe Test for Hot Peel Strength of Copper-Clad Industrial Laminates for Printed Circuits Available from National Electronic Manufacturers Association (NEMA), 2101 L St., NW, Washington, DC 20037.Keywords
copper-clad laminate; dielectric breakdown parallel to laminations; dimensional instability; dissipation factor; fiber reinforced; flexural strength; industrial laminate; laminate; oven blister; peel strength; permittivity; printed circuit boards; printed wiring boards; rigid laminate; solder float; surface resistivity; thermoset; thickness variation; trace; twist; volume resistivity; warp; water absorption ;
ICS Code
ICS Number Code 31.180 (Printed circuits and boards); 83.140.20 (Laminated sheets)
DOI: 10.1520/D5109-99
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