Abstract

These test methods establish the standard procedures for testing copper-clad laminates produced from fiber-reinforced thermosetting polymeric materials intended for fabrication of printed wiring boards. The properties that these test methods shall examine are as follows: dielectric breakdown voltage parallel to laminations; dimensional instability; dissipation factor; flammability rating; flatwise flexural strength at room and elevated temperatures; behavior during oven blister test; peel strength at room and elevated temperatures; permittivity; pin holes and scratches in copper surface; purity of copper; behavior upong solder float test; solvent resistance; surface and volume resistivity; thickness; warp or twist; and water absorption.

This abstract is a brief summary of the referenced standard. It is informational only and not an official part of the standard; the full text of the standard itself must be referred to for its use and application. ASTM does not give any warranty express or implied or make any representation that the contents of this abstract are accurate, complete or up to date.

1. Scope

2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.

ASTM Standards

D150 Test Methods for AC Loss Characteristics and Permittivity (Dielectric Constant) of Solid Electrical Insulation

D229 Test Methods for Rigid Sheet and Plate Materials Used for Electrical Insulation

D257 Test Methods for DC Resistance or Conductance of Insulating Materials

D374 Test Methods for Thickness of Solid Electrical Insulation

D618 Practice for Conditioning Plastics for Testing

D1531 Test Methods for Relative Permittivity (Dielectric Constant) and Dissipation Factor by Fluid Displacement Procedures

D1711 Terminology Relating to Electrical Insulation

D1825 Practice for Etching and Cleaning Copper-Clad Electrical Insulating Materials and Thermosetting Laminates for Electrical Testing

D1867 Specification for Copper-Clad Thermosetting Laminates for Printed Wiring

D3636 Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials

E53 Test Method for Determination of Copper in Unalloyed Copper by Gravimetry

Other Standard

Keywords

copper-clad laminate; dielectric breakdown parallel to laminations; dimensional instability; dissipation factor; fiber reinforced; flexural strength; industrial laminate; laminate; oven blister; peel strength; permittivity; printed circuit boards; printed wiring boards; rigid laminate; solder float; surface resistivity; thermoset; thickness variation; trace; twist; volume resistivity; warp; water absorption ;

ICS Code

ICS Number Code 31.180 (Printed circuits and boards); 83.140.20 (Laminated sheets)

DOI: 10.1520/D5109-12

ASTM International is a member of CrossRef.

ASTM D5109