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ASHRAE Thermal Guidelines for Data Processing Environments, 3rd Edition, 2012
- Thermal Guidelines for Data Processing Environments, Third Edition [Go to Page]
- Contents
- Preface to the Third Edition
- Acknowledgments
- Chapter 1—Introduction [Go to Page]
- Figure 1.1 Heat density trends, projections for information technology products (ASHRAE 2005a).
- Figure 1.2 1U server trends showing 2005 and new 2011 projections (ASHRAE 2012).
- 1.1 Document Flow
- 1.2 Primary Users of This Document
- 1.3 Compliance
- 1.4 Definitions and terms
- Chapter 2—Environmental Guidelines for Air-Cooled Equipment [Go to Page]
- 2.1 Background [Go to Page]
- Figure 2.1 Server metrics for determining data center operating environment envelope.
- 2.2 New Air-Cooled Equipment Environmental Specifications [Go to Page]
- Table 2.1 Comparison of 2004 and 2008 Versions of Recommended Envelopes
- Table 2.2 2008 and 2011 Thermal Guideline Comparisons
- Table 2.5 ETSI Class 3.1 and 3.1e Environmental Requirements
- Figure 2.2 Climatogram of the ETSI Class 3.1 and 3.1e environmental conditions (ETSI 2009).
- Figure 2.3 Environmental classes for data centers—SI Version (see Table 2.3 for dry-bulb temperature derating for altitude).
- Figure 2.4 Environmental Classes for Data Centers—I-P Version (see Table 2.3 for dry-bulb temperature derating for altitude).
- Figure 2.5 World population distribution versus altitude (Cohen and Small 1998).
- 2.3 Guide for the Use and Application of the ASHRAE Data Center Classes [Go to Page]
- Table 2.6 Range of Options to Consider for Optimizing Energy Savings
- 2.4 Server Metrics to Guide Use of New Guidelines [Go to Page]
- 2.4.1 Server Power Trend versus Ambient Temperature
- Figure 2.6 Server power increase (Class A3 is an estimate) versus ambient temperature for Classes A2 and A3.
- Figure 2.7 Server flow rate increase versus ambient temperature increase.
- 2.4.2 Acoustical Noise Levels in Data Center versus Ambient Temperature
- Table 2.7 Expected Increase in A-Weighted Sound Power Level (in decibels)
- 2.4.3 Server Reliability Trend versus Ambient Temperature
- Table 2.8 Relative ITE Failure Rate x-Factor as a Function of Constant ITE Air Inlet Temperature
- Figure 2.8 Time-weighted x-factor estimates for air-side economizer for selected U.S. cities.
- 2.4.4 Server Reliability versus Moisture, Contamination, and other Temperature Effects
- 2.4.5 Server Performance Trend versus Ambient Temperature
- 2.4.6 Server Cost Trend versus Ambient Temperature
- 2.4.7 Summary of New Air-Cooled Equipment Environmental Specifications
- Table 2.3 2011 Thermal Guidelines—SI Version (I-P Version in Appendix B)
- Table 2.4 NEBS Environmental Specifications
- Chapter 3—Environmental Guidelines for Liquid-Cooled Equipment [Go to Page]
- 3.1 ITE Liquid Cooling [Go to Page]
- Figure 3.1 Liquid-cooled rack or cabinet with external CDU.
- Figure 3.2 Combination air- and liquid-cooled rack or cabinet with internal CDU.
- Figure 3.3 Liquid-cooling systems/loops for a data center.
- 3.2 Facility Water Supply Characteristics for ITE [Go to Page]
- 3.2.1 Facility Water Supply Temperature Classes for ITE [Go to Page]
- 3.2.1.1 Liquid-Cooling Environmental Class Definitions
- Table 3.1 2011 ASHRAE Liquid-Cooled Guidelines
- Figure 3.4 Class W1/W2/W3 liquid-cooling classes typical infrastructure.
- Figure 3.5 Class W4 liquid-cooling class typical infrastructure.
- Figure 3.6 Class W5 liquid-cooling class typical infrastructure.
- 3.2.2 Condensation Considerations
- 3.2.3 Operational Characteristics
- Figure 3.7 Typical water flow rates for constant heat load.
- 3.2.4 Water Flow Rates/Pressures
- 3.2.5 Velocity Limits
- 3.2.6 Water Quality
- Table 3.2 Maximum Velocity Requirements
- Table 3.3 Water Quality Specifications Supplied to ITE
- 3.3 Liquid-Cooling Deployments in NEBS-Compliant Spaces [Go to Page]
- Figure 3.8 Liquid cooling systems/loops for a NEBS space.
- 3.3.1 NEBS Space Similarities and Differences
- 3.3.2 Use of CDU in NEBS Spaces
- 3.3.3 Refrigerant Distribution Infrastructure
- 3.3.4 Connections
- 3.3.5 Condensation Consideration
- 3.3.6 Close-Coupled Cooling Units
- Chapter 4—Facility Temperature and Humidity Measurement [Go to Page]
- 4.1 Facility Health and Audit Tests [Go to Page]
- Figure 4.1 Measurement points in aisle.
- 4.1.1 Aisle Measurement Locations
- Figure 4.2 Measurement points between rows.
- Figure 4.3 Measurement points in a hot-aisle/cold-aisle configuration.
- 4.1.2 HVAC Operational Status
- 4.1.3 Evaluation [Go to Page]
- 4.1.3.1 Aisle Temperature and Humidity Levels
- 4.1.3.2 HVAC Unit Operation
- 4.2 Equipment Installation Verification Tests [Go to Page]
- Figure 4.4 Monitor points for configured racks.
- 4.3 Equipment Troubleshooting Tests [Go to Page]
- Figure 4.5 Monitor points for 1U to 3U equipment.
- Figure 4.6 Monitor points for 4U to 6U equipment.
- Figure 4.7 Monitor points for 7U and larger equipment.
- Figure 4.8 Monitor points for equipment with localized cooling.
- Chapter 5—
Equipment Placement and Airflow Patterns [Go to Page]
- 5.1 Equipment Airflow [Go to Page]
- 5.1.1 Airflow Protocol Syntax
- 5.1.2 Airflow Protocol for Equipment
- Figure 5.1 Syntax of face definitions.
- Figure 5.2 Recommended airflow protocol.
- Figure 5.3 View of a hot-aisle/cold-aisle configuration.
- 5.1.3 Cabinet Design
- 5.2 Equipment Room Airflow [Go to Page]
- 5.2.1 Placement of Cabinets and Rows of Cabinets
- Figure 5.4 View of a hot-aisle/cold-aisle configuration.
- Figure 5.5 Example of hot and cold aisles for nonraised floor.
- 5.2.2 Cabinets with Dissimilar Airflow Patterns
- Figure 5.6 Seven-tile aisle pitch, equipment aligned on cold aisle.
- 5.2.3 Aisle Pitch
- Table 5.1 Aisle Pitch Allocation
- Figure 5.7 Seven-tile aisle pitch, equipment aligned on hot aisle.
- Chapter 6—Equipment Manufacturers’ Heat and Airflow Reporting [Go to Page]
- 6.1 Providing Heat Release and Airflow Values
- 6.2 Equipment Thermal Report
- 6.3 EPA Energy Star Reporting [Go to Page]
- Table 6.1 Example Thermal Report (Continued)
- 6.3.1 Server Thermal Data Reporting Capabilities
- Appendix A—2008 ASHRAE Environmental Guidelines for Datacom Equipment—Expanding the Recommended Environmental Envelope [Go to Page]
- Table A.1 Comparison of 2004 and 2008 Versions of Recommended Envelopes
- Figure A.1 2008 recommended environmental envelope (new Class 1 and 2).
- Figure A.2 Inlet and component temperatures with fixed fan speed.
- Figure A.3 Inlet and component temperatures with variable fan speed.
- Appendix B—2011 Air-Cooled Equipment Thermal Guidelines (I-P) [Go to Page]
- Table B.1 2011 Thermal Guidelines—IP Version (SI Version in Table 2.3)
- Appendix C—Detailed Flowchart for the Use and Application of the ASHRAE Data Center Classes [Go to Page]
- Figure C.1 Guidance for applying thermal guidelines.
- Figure C.2 Guidance for applying thermal guidelines.
- Figure C.3 Guidance for applying thermal guidelines to major retrofit projects.
- Figure C.4 Guidance for applying thermal guidelines to existing facilities looking for efficiency gains.
- Appendix D—Static Control Measures [Go to Page]
- Figure D.1 Typical test setup to measure floor conductivity.
- Appendix E—OSHA and Personnel Working in High Air Temperatures [Go to Page]
- Table E.1 Permissible Heat Exposure Threshold Limit Value (ACGIH 1992)
- Appendix F—Psychrometric Charts [Go to Page]
- Figure F.1 Allowable Class A1–A4, B, and C operating conditions (SI units).
- Figure F.2 Allowable Class A1–A4, B, and C operating conditions (I-P units).
- Figure F.3 Allowable data center and NEBS operating conditions (SI units).
- Figure F.4 Allowable data center and NEBS operating conditions (I-P units).
- Figure F.5 Recommended data center and central office operating conditions (SI units).
- Figure F.6 Recommended data center and central office operating conditions (I-P units).
- Appendix G—Altitude Derating Curves [Go to Page]
- Figure G.1 Class A1 to A4 temperature vs. altitude.
- Figure G.2 Classes A1 and A2 and NEBS temperature vs. altitude. (*Shown NEBS temperature derating for increased altitude is for reference only; actual derating is equipment-supplier dependent.)
- Appendix H—Practical Example of the Impact of Compressorless Cooling on Hardware Failure Rates [Go to Page]
- Figure H.1 Histogram of dry-bulb temperatures for Chicago.
- Figure H.2 Dry-bulb temperatures for Chicago with economization assumptions that include reuse of ITE exhaust heat to maintain a minimum 15°C to 20°C (59°F to 68°F) temperature and a 1.5°C (2.7°F) temperature rise from outdoor air to server inlet.
- Table H.1 Time-at-Temperature Weighted Failure Rate Calculation for ITE in Chicago
- Appendix I—IT Equipment Reliability Data for Selected Major U.S. and Global Cities [Go to Page]
- Figure I.1 Failure rate projections for air-side economizer for selected U.S. cities.
- Figure I.2 Failure rate projections for water-side economizer for selected U.S. cities.
- Table I.1 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Air-Side Economization for Selected Major U.S. Cities Assuming a 1.5°C (2.7°F) Temperature Rise between Outdoor Ambient Temperature and the ITE Inlet Air Temperature
- Table I.2 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Water-Side Economization for Selected Major U.S. Cities Assuming a 9°C (16.2°F) Temperature Rise between Outdoor Ambient Temperature and the ITE Inlet Air Temperature
- Figure I.3 Failure rate projections for water-side economizer with a dry- cooler-type tower for selected U.S. cities.
- Figure I.4 Failure rate projections for air-side economizer for selected global cities.
- Table I.3 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Water-Side Dry-Cooler-Type Tower Economization for Selected Major U.S. Cities Assuming a 12°C (21.6°F) Temperature Rise between Outdoor Ambient Temperature and the ITE Inle...
- Table I.4 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Air-Side Economization for Selected Major Global Cities Assuming a 1.5°C (2.7°F) Temperature Rise between Outdoor Ambient Temperature and the ITE Inlet Air Temperature
- Figure I.5 Failure rate projections for water-side economizer for selected global cities.
- Figure I.6 Failure rate projections for water-side economizer with a dry- cooler-type tower for selected global cities.
- Table I.5 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Water-Side Economization for Selected Major U.S. Cities Assuming an 9°C (16.2°F) Temperature Rise between Outdoor Ambient Temperature and the ITE Inlet Air Temperature
- Table I.6 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Water-Side Dry-Cooler Type Tower Economization for Selected Major U.S. Cities Assuming a 12°C (21.6°F) Temperature Rise between Outdoor Ambient Temperature and the ITE Inle...
- Figure I.7 Number of hours per year of chiller operation required for air- side economizer for selected U.S. cities.
- Figure I.8 Number of hours per year of chiller operation required for water-side economizer for selected U.S.cities.
- Figure I.9 Number of hours per year of chiller operation required for water-side dry-cooler economizer for selected U.S.cities.
- Figure I.10 Number of hours per year of chiller operation required for air- side economizer for selected global cities.
- Figure I.11 Number of hours per year of chiller operation required for water-side economizer for selected global cities.
- Figure I.12 Number of hours per year of chiller operation required for water-side dry-cooler economizer for selected global cities.
- Appendix J Most Common Problems in Water-Cooled Systems
- References and Bibliography [Go to Page]