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ASHRAE Datacom Series Book 1: Thermal Guidelines for Data Processing Environments, 4th Edition, 2015
- Contents
- Preface to the Fourth Edition
- Acknowledgments [Go to Page]
- Figure 1.1 Heat density trends, projections for information technology products (ASHRAE 2012).
- Figure 1.2 1U server trends showing 2005 and 2011 projections (ASHRAE 2012).
- 1.1 Book Flow
- 1.2 Primary Users of This Book
- 1.3 Compliance
- 1.4 Definitions and terms
- I Introduction
- 2.1 Background [Go to Page]
- Figure 2.1 Server metrics for determining data center operating environment envelope.
- 2.2 New Air-Cooled Equipment Environmental Specifications [Go to Page]
- Figure 2.2 2011 recommended and allowable envelopes for ASHRAE Classes A1, A2, A3, and A4.
- Figure 2.3 2015 recommended and allowable envelopes for ASHRAE Classes A1, A2, A3, and A4.
- 2.2.1 Environmental Class Definitions for Air-Cooled Equipment [Go to Page]
- Figure 2.4 Climatogram of Class A3 illustrating how dew-point limits modify relative humidity specification limits.
- Table 2.3 ETSI Class 3.1 and 3.1e Environmental Requirements (ETSI 2009)
- Figure 2.5 Climatogram of the ETSI Class 3.1 and 3.1e environmental conditions (ETSI 2009).
- Figure 2.6 World population distribution versus altitude (Cohen and Small 1998).
- 2.3 Guide for the Use and Application of the ASHRAE Data Center Classes
- 2.4 Server Metrics to Guide Use of New Guidelines [Go to Page]
- Table 2.4 Range of Options to Consider for Optimizing Energy Savings
- 2.4.1 Server Power Trend Versus Ambient Temperature [Go to Page]
- Figure 2.7 Server power increase (Class A3 is an estimate) versus ambient temperature for Classes A2 and A3.
- Figure 2.8 Server flow rate increase versus ambient temperature increase.
- 2.4.2 Acoustical Noise Levels in Data Center Versus Ambient Temperature [Go to Page]
- Table 2.5 Expected Increase in A-Weighted Sound Power Level (in Decibels)
- 2.4.3 Server Reliability Trend Versus Ambient Temperature [Go to Page]
- Table 2.6 Relative ITE Failure Rate x-Factor as Function of Constant ITE Air Inlet Temperature
- Figure 2.9 Time-weighted x-factor estimates for air-side economizer use for selected U.S. cities.
- 2.4.4 Server Reliability Versus Moisture, Contamination, and Other Temperature Effects
- 2.4.5 Server Performance Trend Versus Ambient Temperature
- 2.4.6 Server Cost Trend Versus Ambient Temperature
- 2.4.7 Summary of New Air-Cooled Equipment Environmental Specifications
- 2 Environmental Guidelines for Air-Cooled Equipment [Go to Page]
- Table 2.1 2015 Thermal Guidelines—SI Version (I-P Version in Appendix B)
- Table 2.2 NEBS Environmental Specifications
- 3.1 ITE Liquid Cooling [Go to Page]
- Figure 3.1 Liquid-cooled rack or cabinet with external CDU.
- Figure 3.2 Combination air- and liquid-cooled rack or cabinet with internal CDU.
- Figure 3.3 Liquid-cooling systems/loops for a data center.
- 3.2 Facility Water Supply Characteristics for ITE
- 3.2.1 Facility Water Supply Temperature Classes for ITE [Go to Page]
- Table 3.1 2011 ASHRAE Liquid-Cooled Guidelines
- Figure 3.4 Liquid-cooling Classes W1, W2, and W3 typical infrastructure.
- Figure 3.5 Liquid-cooling Class W4 typical infrastructure.
- Figure 3.6 Liquid-cooling Class W5 typical infrastructure.
- 3.2.2 Condensation Considerations
- 3.2.3 Operational Characteristics [Go to Page]
- Figure 3.7 Typical water flow rates for constant heat load.
- 3.2.4 Water Flow Rates/Pressures
- 3.2.5 Velocity Limits
- 3.2.6 Water Quality
- 3.3 Liquid-Cooling Deployments in NEBS-Compliant Spaces [Go to Page]
- Table 3.2 Maximum Velocity Requirements
- Table 3.3 Water Quality Specifications Supplied to ITE
- 3.3.1 NEBS Space Similarities and Differences [Go to Page]
- Figure 3.8 Liquid cooling systems/loops for a NEBS space.
- 3.3.2 Use of CDU in NEBS Spaces
- 3.3.3 Refrigerant Distribution Infrastructure
- 3.3.4 Connections
- 3.3.5 Condensation Consideration
- 3.3.6 Close-Coupled Cooling Units
- 3 Environmental Guidelines for Liquid-Cooled Equipment
- 4.1 Facility Health and Audit Tests [Go to Page]
- Figure 4.1 Measurement points in aisle.
- 4.1.1 Aisle Measurement Locations [Go to Page]
- Figure 4.2 Measurement points between rows.
- Figure 4.3 Measurement points in a hot-aisle/cold-aisle configuration.
- 4.1.2 HVAC Operational Status
- 4.1.3 Evaluation
- 4.2 Equipment Installation Verification Tests [Go to Page]
- Figure 4.4 Monitor points for configured racks.
- 4.3 Equipment Troubleshooting Tests [Go to Page]
- Figure 4.5 Monitor points for 1U to 3U equipment.
- Figure 4.6 Monitor points for 4U to 6U equipment.
- Figure 4.7 Monitor points for 7U and larger equipment.
- Figure 4.8 Monitor points for equipment with localized cooling.
- 4 Facility Temperature and Humidity Measurement
- 5.1 Equipment Airflow
- 5.1.1 Airflow Protocol Syntax
- 5.1.2 Airflow Protocol for Equipment [Go to Page]
- Figure 5.1 Syntax of face definitions.
- Figure 5.2 Recommended airflow protocol.
- 5.1.3 Cabinet Design
- 5.2 Equipment Room Airflow
- 5.2.1 Placement of Cabinets and Rows of Cabinets [Go to Page]
- Figure 5.3 View of a hot-aisle/cold-aisle configuration.
- Figure 5.4 Example of hot and cold aisles for raised-floor environments with underfloor cooling.
- Figure 5.5 Example of hot and cold aisles for non-raised-floor environments with overhead cooling.
- 5.2.2 Cabinets with Dissimilar Airflow Patterns
- 5.2.3 Aisle Pitch [Go to Page]
- Figure 5.6 Seven-tile aisle pitch, equipment aligned on hot aisle.
- Table 5.1 Aisle Pitch Allocation
- Figure 5.7 Seven-tile aisle pitch, equipment aligned on cold aisle.
- 5 Equipment Placement and Airflow Patterns
- 6.1 Providing Heat Release and Airflow Values
- 6.2 Equipment Thermal Report [Go to Page]
- Table 6.1 Example Thermal Report
- 6.3 EPA Energy Star
- 6.3.1 Server Thermal Data Reporting Capabilities
- 6 Equipment Manufacturers’ Heat and Airflow Reporting [Go to Page]
- Table A.1 Comparison of 2004, 2008/2011, and 2015 Versions of Recommended Envelopes
- Figure A.1 2008 recommended environmental envelope (new Classes 1 and 2).
- Figure A.2 Inlet and component temperatures with fixed fan speed.
- Figure A.3 Inlet and component temperatures with variable fan speed.
- Appendix A 2015 ASHRAE Environmental Guidelines for Datacom Equipment—Expanding the Recommended Environmental Envelope [Go to Page]
- Table B.1 2015 Thermal Guidelines—I-P Version (SI Version in Table 2.1)
- Appendix B 2015 Air-Cooled Equipment Thermal Guidelines (I-P) [Go to Page]
- Figure C.1 Guidance for applying thermal guidelines.
- Figure C.2 Guidance for applying thermal guidelines to new construction projects.
- Figure C.3 Guidance for applying thermal guidelines to major retrofit projects.
- Figure C.4 Guidance for applying thermal guidelines to existing facilities looking for efficiency gains.
- Appendix C Detailed Flowchart for the Use and Application of the ASHRAE Data Center Classes [Go to Page]
- Figure D.1 Walking pattern according to ANSI/ESD STM97.2.
- Figure D.2 Walking voltage test setup according to ANSI/ESD STM97.2.
- Table D.1 Types of Floor and Shoes Used in Test Program
- Table D.2 Flooring and Shoes Defined by Electrical Resistance
- Table D.3 Probabilities of Voltages from Walking Tests Greater than Threshold Values
- D.2 Personnel and Operational Issues
- D.3 Flooring Issues [Go to Page]
- Figure D.3 Typical test setup to measure floor conductivity.
- Appendix D ESD Research and Static Control Measures [Go to Page]
- Table E.1 Permissible Heat Exposure Threshold Limit Value (TLV) (ACGIH 1992)
- Appendix E OSHA and Personnel Working in High Air Temperatures [Go to Page]
- Figure F.1 Allowable Class A1 through A4 operating conditions (SI units).
- Figure F.2 Allowable Class A1 through A4 operating conditions (I-P units).
- Figure F.3 Allowable data center and NEBS operating conditions (SI units).
- Figure F.4 Allowable data center and NEBS operating conditions (I-P units).
- Figure F.5 Recommended data center and central office operating conditions (SI units).
- Figure F.6 Recommended data center and central office operating conditions (I-P units).
- Appendix F Psychrometric Charts [Go to Page]
- Figure G.1 Class A1 to A4 temperature versus altitude.
- Figure G.2 Classes A1 and A2 and NEBS temperature versus altitude.
- Appendix G Altitude Derating Curves [Go to Page]
- Figure H.1 Histogram of dry-bulb temperatures for Chicago.
- Figure H.2 Dry-bulb temperatures for Chicago with economization assumptions that include reuse of ITE exhaust heat to maintain a minimum 15°C to 20°C (59°F to 68°F) temperature and a 1.5°C (2.7°F) temperature rise from outdoor air to server inlet.
- Table H.1 Time-at-Temperature Weighted Failure Rate Calculation for ITE in Chicago
- Appendix H Practical Example of the Impact of Compressorless Cooling on Hardware Failure Rates [Go to Page]
- Figure I.1 Failure rate projections for air-side economizer for selected U.S. cities.
- Figure I.2 Failure rate projections for water-side economizer for selected U.S. cities.
- Table I.1 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Air-Side Economization for Selected Major U.S. Cities Assuming 1.5°C (2.7°F) Temperature Rise between Outdoor Ambient Temperature and ITE Inlet Air Temperature
- Table I.2 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Water-Side Economization for Selected Major U.S. Cities Assuming 9°C (16.2°F) Temperature Rise between Outdoor Ambient Temperature and ITE Inlet Air Temperature
- Figure I.3 Failure rate projections for water-side economizer with dry- cooler-type tower for selected U.S. cities.
- Figure I.4 Failure rate projections for air-side economizer for selected global cities.
- Table I.3 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Water-Side Dry-Cooler-Type Tower Economization for Selected Major U.S. Cities Assuming 12°C (21.6°F) Temperature Rise between Outdoor Ambient Temperature and ITE Inlet Air ...
- Table I.4 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Air-Side Economization for Selected Major Global Cities Assuming 1.5°C (2.7°F) Temperature Rise between Outdoor Ambient Temperature and ITE Inlet Air Temperature
- Figure I.5 Failure rate projections for water-side economizer for selected global cities.
- Figure I.6 Failure rate projections for water-side economizer with dry- cooler-type tower for selected global cities.
- Table I.5 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Water-Side Economization for Selected Major U.S. Cities Assuming 9°C (16.2°F) Temperature Rise between Outdoor Ambient Temperature and ITE Inlet Air Temperature
- Table I.6 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Water-Side Dry-Cooler-ype Tower Economization for Selected Major U.S. Cities Assuming 12°C (21.6°F) Temperature Rise between Outdoor Ambient Temperature and ITE Inlet Air T...
- Figure I.7 Number of hours per year of chiller operation required for air- side economizer for selected U.S. cities.
- Figure I.8 Number of hours per year of chiller operation required for water-side economizer for selected U.S. cities.
- Figure I.9 Number of hours per year of chiller operation required for water-side dry-cooler economizer for selected U.S.cities.
- Figure I.10 Number of hours per year of chiller operation required for air- side economizer for selected global cities.
- Figure I.11 Number of hours per year of chiller operation required for water-side economizer for selected global cities.
- Figure I.12 Number of hours per year of chiller operation required for water-side dry-cooler economizer for selected global cities.
- Appendix I ITE Reliability Data for Selected Major U.S. and Global Cities
- J.2 Fouling—Insoluble particulate matter in water
- J.3 Scale—Precipitation of salts directly on metal surfaces
- J.4 Microbiologically induced corrosion— Corrosion due to bacteria, fungi, and algae
- Appendix J Most Common Problems in Water-Cooled Systems [Go to Page]
- Figure K.1 Examples of tape equipment inlet air temperature versus time that are compliant with the 5°C (9°F) in an hour temperature change requirement for data center rooms with tape. equipment.
- Figure K.2 Examples of tape equipment inlet air temperature versus time that are noncompliant with the 5°C (9°F) in an hour temperature change requirement for data center rooms with tape equipment.
- Figure K.3 Examples of equipment inlet air temperature versus time that are compliant with the 20°C (36°F) in an hour and the 5°C (9°F) in 15 minutes temperature change requirement for data center rooms that contain other types of ITE not includi...
- Figure K.4 Examples of equipment inlet air temperature versus time that: a) are noncompliant with the 20°C (36°F) in an hour, b) are noncompliant with the 5°C (9°F) in 15 minutes temperature change, and c) are noncompliant with 5°C (9°F) in 15 ...
- Figure K.5 Example of ITE air inlet temperature rate of change (°C/h) calculated over 1 min, 5 min, 15 min, and 60 min time intervals.
- Figure K.6 Example of time delay between inlet air temperature change to storage array and the corresponding temperature change in hard-disk drives of the storage array.
- Appendix K Allowable Server Inlet Temperature Rate of Change [Go to Page]
- Figure L.1 Class A3 climatogram illustrating how dew-point limits modify RH specification limits.
- Figure L.2 Climatogram of recommended range for Classes A1 to A4.
- Figure L.3 Class A1 and A2 operation climatograms.
- Figure L.4 Class A1 and Class A2 power-off climatogram.
- Figure L.5 Class A3 operation and power-off climatograms.
- Figure L.6 Class A4 operation and power-off climatograms.
- Figure L.7 Class B and Class C operation climatograms.
- Figure L.8 Classes B and Class C power-off climatogram.
- Appendix L Allowable Server Inlet RH Limits Versus Maximum Inlet Dry-Bulb Temperature
- References and Bibliography [Go to Page]