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Description of ASTM-F1260M 1996ASTM F1260M-96Historical Standard: Standard Test Method for Estimating Electromigration Median Time-To-Failure and Sigma of Integrated Circuit Metallizations [Metric]ASTM F1260MScope 1.1 This test method is designed to characterize the failure distribution of interconnect metallizations such as are used in microelectronic circuits and devices that fail due to electromigration under specified d-c current-density and temperature stress. This test method is intended to be used only when the failure distribution can be described by a log-Normal distribution. 1.2 This test method is intended for use as a referee method between laboratories and for comparing metallization alloys and metallizations prepared in different ways. It is not intended for qualifying vendors or for determining the use-life of a metallization. 1.3 The test method is an accelerated stress test of four-terminal structures (see Guide F 1259M) where the failure criterion is either an open circuit in the test line or a prescribed percent increase in the resistance of the test structure. 1.4 This test method allows the test structures of a test chip to be stressed while still part of the wafer (or a portion thereof) or while bonded to a package and electrically accessible by means of package terminals. 1.5 This test method is not designed to characterize the metallization for failure modes involving short circuits between adjacent metallization lines or between two levels of metallization. 1.6 This test method is not intended for the case where the stress test is terminated before all parts have failed. 1.7 This test method is primarily designed to analyze complete data. An option is provided for analyzing censored data (that is, when the stress test is halted before all parts under test have failed). 1.8 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. Keywords electromigration; electromigration metallization; integrated circuit; microelectronics; open circuit; resistance increase; time-to-failure ICS Code ICS Number Code 17.220.20 (Measurement of electrical and magnetic quantities) DOI: 10.1520/F1260M-96 The following editions for this book are also available...
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About ASTMASTM International, formerly known as the American Society for Testing and Materials (ASTM), is a globally recognized leader in the development and delivery of international voluntary consensus standards. Today, some 12,000 ASTM standards are used around the world to improve product quality, enhance safety, facilitate market access and trade, and build consumer confidence. ASTM’s leadership in international standards development is driven by the contributions of its members: more than 30,000 of the world’s top technical experts and business professionals representing 150 countries. Working in an open and transparent process and using ASTM’s advanced electronic infrastructure, ASTM members deliver the test methods, specifications, guides, and practices that support industries and governments worldwide. |
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