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IT Equipment Power Trends, 3rd Edition, 2018
- IT Equipment Power Trends, Third Edition [Go to Page]
- Contents
- Foreward
- Preface
- Acknowledgments
- 1.1 Purpose/Objective
- 2.1 Datacom Facility Planning [Go to Page]
- Table 2.1 Enterprise Data Center Facility Breakdown Example
- Figure 2.1 Data center breakdown: data center plus all supporting spaces.
- Table 2.2 Datacom Computer Room Area Breakdown Example
- Figure 2.2 Datacom computer room area breakdown example.
- Figure 2.3 White space density as a function of rack heat load example.
- 2.2 Floor Space for Existing Applications [Go to Page]
- 2.2.1 Performance Growth of Technology Based on Footprint
- 2.2.2 Change in Applications Over Time
- 2.2.3 Asset Turnover
- 2.3 IT and Facility Industry Collaboration
- 2.4 IT Industry Background
- 3.1 Servers [Go to Page]
- Figure 3.1 Typical compute server rack and packaging.
- Figure 3.2 1U dual-socket volume servers.
- Figure 3.3 2U chassis with four 1U 1/2-width nodes or boards.
- Figure 3.4 4U microserver chassis, housing dozens of microservers.
- Figure 3.5 Blade example.
- 3.2 Storage Arrays [Go to Page]
- Figure 3.6 Blade server chassis example.
- Figure 3.7 Front and rear view of storage array enclosure.
- 3.3 Data Center Networking [Go to Page]
- Figure 3.8 Example of a typical data center networking implementation.
- Figure 3.9 TOR switch with top cover removed.
- Figure 3.10 Processor package ingredients.
- 3.4 Components [Go to Page]
- 3.4.1 Central Processing Unit [Go to Page]
- Figure 3.11 Processor package with substrate and lid.
- Figure 3.12 Processor air-cooled heat sink.
- Figure 3.13 Processor heat sink for liquid cooling (disassembled).
- Figure 3.14 MIC processor and all its cores. The arrow points to the outline of one core.
- 3.4.2 Graphics Processing Unit [Go to Page]
- Figure 3.15 GPU with an aluminum fin heat sink and embedded heat pipes.
- 3.4.3 Volatile Memory [Go to Page]
- Figure 3.16 Typical dual in-line memory module (DIMM) with and without a heat spreader.
- 3.4.4 Nonvolatile Memory
- 3.4.5 Nonvolatile Storage [Go to Page]
- Figure 3.17 (a) A NVM small form factor SSD and (b) a PCIe NVM SSD.
- Figure 3.18 Illustration showing drive power as function of drive surface area, revealing that the smaller M.2 has a higher heat density.
- Figure 3.19 60 mm, 80 mm, and 110 mm long M.2 devices.
- Figure 3.20 Enterprise NVM storage power planning guide.
- 3.4.6 Spinning Disk and Tape Storage [Go to Page]
- Figure 3.21 Typical HDD component view.
- Table 3.1 Empirically Measured HDD Idle and Active Power Levels
- Figure 3.22 Example of (a) single tape drive and (b) tape media cartridge.
- 3.4.7 Motherboard
- 3.4.8 PCIe I/O Cards [Go to Page]
- Figure 3.23 Example of a typical 1/2-wide server motherboard.
- 3.4.9 Power Supplies [Go to Page]
- Figure 3.24 80 Plus power supply efficiency curves.
- 4.1 Introduction
- 4.2 Workload Types [Go to Page]
- Table 4.1 Workload Types
- Table 4.2 Common Subsystem Utilization per Workload Type
- 4.3 IT Equipment Size and Configuration Matters [Go to Page]
- Figure 4.1 Volume server subsystem utilization by workload type.
- Table 4.3 Measured Heat Load for a Given Workload Type
- Figure 4.2 2U 2-socket configuration and power comparison between cloud/IPDC and scientific servers.
- Figure 4.3 An example of the measured heat load per 2U server for each workload type.
- 4.4 Measured Loads [Go to Page]
- Table 4.4 An Example of the Measured Heat Load per 2U Server for Each Workload Type
- 4.5 Application Deployment Models and Impact on Power [Go to Page]
- Figure 4.4 Physically provisioned application deployment.
- Figure 4.5 Virtualization application deployment.
- Figure 4.6 Operating system virtualization application deployment.
- Figure 4.7 Hyperconvergence application deployment.
- 5.1 Introduction
- 5.2 Power Trend Chart Evolution [Go to Page]
- Figure 5.1 Evolution of the ASHRAE power trends from the second edition to the third edition for 2U 2S servers.
- 5.3 Measured Load Projections to Use as Guidelines [Go to Page]
- Figure 5.2 Scientific and Business processing rack power trend.
- 5.4 Volume Servers [Go to Page]
- Figure 5.3 Analytics rack power trend.
- Figure 5.4 Cloud/IPDC rack power trend.
- Figure 5.5 Visualization and audio rack power trend.
- Figure 5.6 Communications rack power trend.
- Figure 5.7 Storage rack power trend.
- Figure 5.8 CAGR per workload type and common server size.
- 5.5 IT Equipment Compound Annual Growth Rate [Go to Page]
- Table 5.1 CAGR per Workload Type and Common Server Size
- 5.6 Networking Equipment [Go to Page]
- Figure 5.9 Network switch power trend per connected unit. (Note: Speed and number of ports will depend on the hierarchy of layout network.)
- Table 5.2 Common or Typical Network Switch Power Data
- 5.7 Server Efficiency [Go to Page]
- Figure 5.10 Historical performance and power trends.
- Figure 5.11 Historical server efficiency trends.
- 5.8 Product Cycle versus Building Life Cycle
- 6.1 Introduction
- 6.2 Air-cooled IT Equipment Facility Designs and Capabilities [Go to Page]
- Figure 6.1 Server air temperature rise (T) trends at 25°C (77°F) server inlet temperature.
- Figure 6.2 Overall airflow and corresponding rack power capacity in current data center projections assuming a 28°C (82.4°F) rise through a rack.
- Figure 6.3 Airflow required per average workload and data center capability.
- 6.3 Liquid-Cooled IT Equipment and Facility Capabilities [Go to Page]
- Figure 6.4 Liquid cooling implementations and capabilities.
- 6.4 Provisioning For Future Loads
- 7.1 Introduction
- 7.2 Using the CAGR for Future Datacom Facility Load Planning [Go to Page]
- 7.2.1 Step 1—Identify and Document the Current Workload Types, Powers, and CAGRs
- 7.2.2 Step 2—For Each Refresh Interval, Create an Inventory of IT Equipment [Go to Page]
- Table 7.1 Identify and Document the Current IT Equipment Workload Types, Powers, and Deployment Strategy Example Only—Data Can Vary Dramatically Because Each Facility is Unique
- Table 7.2 Inventory of Rack IT Equipment Deployment and Future Power Consumption at the First IT Equipment Refresh Example Only—Data Can Vary Dramatically Because Each Facility is Unique
- 7.2.3 Step 3—For Each New IT Equipment Being Deployed, Calculate the Future Heat Load Based on the CAGR
- 7.2.4 Step 4—Compute the Rack Heat Load at Each Refresh Interval
- 7.3 Simple Example of Datacom Equipment Workload Type Impact on Facility Cooling Growth [Go to Page]
- Table 7.3 Inventory of Rack IT Equipment Deployment and Future Power Consumption at the Second IT Equipment Refresh Example Only—Data Can Vary Dramatically Because Each Facility is Unique
- Table 7.4 Heat Load per Rack at Each Refresh Interval
- Table 7.5 2500 ft² (232 m²) Datacom Equipment Room Breakdown—Current Chilled-Water Cooling Load
- Table 7.6 2500 ft² (232 m²) Datacom Equipment Room Breakdown—Future Chilled-Water Cooling Load Scenario
- 7.4 Networking Switch Power Example [Go to Page]
- Figure 7.1 Example of common networking hierarchy and power calculations.
- Table 7.7 Common or Typical Network Switch Power Data [Go to Page]