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Design Considerations for Datacom Equipment Centers, Second Edition, 2009
- OVERVIEW OF CHAPTERS
- Part I: Datacom Facility Basics
- Part II: Other Considerations
- 2.1 Overview
- 2.2 Environmental Requirements
- Table 2.1 Class 1, Class 2, and NEBS Design Conditions
- 2.3 Temperature
- Figure 2.2 Class 1, Class 2, and NEBS allowable temperature range vs. altitude.
- 2.4 Temperature Rate of Change
- 2.5 Humidity
- 2.6 Filtration and Contamination
- 2.7 Ventilation
- 2.8 Envelope Considerations
- 2.9 Human Comfort
- 2.10 Flexibility
- 2.11 Additional Considerations
- Figure 2.1a Recommended data center Class 1, Class 2, and NEBS operating conditions. Refer to ASHRAE’s Thermal Guidelines, Second Edition (ASHRAE 2009) for an equivalent figure with SI units.
- Figure 2.1b Allowable data center Class 1, Class 2, and NEBS operating conditions. Refer to ASHRAE’s Thermal Guidelines (ASHRAE 2009) for an equivalent figure with SI units.
- 3.1 Datacom Equipment
- 3.2 Equipment Loads, including High-Density Loads
- 3.2.1 Trends
- 3.2.2 Equipment Heat Load Calculations
- 3.3 Electrical Distribution Equipment
- 3.4 Other Loads
- 3.4.1 Ventilation and Infiltration
- Table 3.1 Sample Calculation—Overall Heat Loads Expected in a New Facility with Vintage 2005 Equipment
- 3.4.2 Lights
- 3.4.3 People
- 3.4.4 Envelope
- 3.4.5 Transmission
- 3.4.6 Heating and Reheat
- 3.4.7 Humidification
- 4.1 Computer Room Air-Conditioning (CRAC) Units
- 4.1.1 Cooling
- 4.1.2 Location
- 4.1.3 Humidity Control
- 4.1.4 Ventilation
- 4.2 Central Station Air-Handling Units
- 4.2.1 Coil Selection
- 4.2.2 Humidification
- 4.2.3 Part-Load Efficiency and Energy Recovery
- 4.2.4 Flexibility/Redundancy Using VAV Systems
- 4.3 Liquid Cooling
- 4.4 Chilled-Water Distribution Systems
- Figure 4.2 Chilled-water loop distribution.
- 4.5 Condenser Systems
- 4.6 Refrigeration
- 4.7 Chillers
- 4.8 Pumps
- 4.9 Piping
- 4.10 Humidifiers
- 4.11 Controls and Monitoring
- 4.11.1 Controls
- 4.11.2 Monitoring
- Figure 4.1 Datacom facility with dedicated outdoor air preconditioning.
- 5.1 Introduction
- 5.2 Airflow Through Equipment
- 5.2.1 Design Conditions
- 5.2.2 Once-Through Concept
- 5.2.3 Equipment Cooling Classes
- Figure 5.1 Recommended equipment airflow directivity protocols.
- 5.2.4 Blanking Panels
- 5.2.5 Equipment Airflow
- 5.3 Airflow through Equipment Rooms
- 5.3.1 Hot-Aisle/Cold-Aisle Protocol
- 5.3.2 Placement of Racks
- 5.3.3 Equipment Room Airflow
- 5.3.4 Cooling Effectiveness
- 5.4 CFD Modeling
- 5.5 Room Cooling Classes (Protocols)
- 5.5.1 Syntax for RC-Classes
- 5.5.2 Vertical Underfloor (VUF)
- 5.5.3 Overhead (VOH)
- Figure 5.3 Typical ducted ceiling distribution used in datacom facilities.
- 5.5.4 Horizontal Displacement (HDP)
- 5.5.5 Horizontal Overhead (HOH)
- 5.5.6 Natural Convection Overhead (NOH)
- 5.5.7 Supplemental Cooling
- Figure 5.2 Schematic of a datacom equipment room with underfloor raised-floor air space supply air distribution.
- 6.1 Liquid Cooling Overview
- 6.2 Datacom Facility Chilled-Water Systems
- 6.3 Liquid-Cooled Computer Equipment
- 6.4 Cooling Liquids
- 6.4.1 Dielectric Fluids
- 6.4.2 Water
- 6.4.3 Refrigerants
- 6.5 Reliability
- Figure 6.1 Internal liquid cooling loop restricted to within rack extents.
- Figure 6.2 Internal liquid cooling loop within rack extents and external liquid cooling loop to racks.
- Figure 6.3 Internal liquid cooling loop extended to liquid-cooled external modular cooling unit.
- Figure 6.4 Hybrid rack cooling system—internal liquid cooling loop extended to liquid-cooled external modular cooling unit and rack air-cooled components.
- Figure 6.5 Hybrid rack cooling system—rack level liquid cooling loop extended to liquid-cooled external modular cooling unit and rack air-cooled components.
- Figure 6.6 Hybrid rack cooling system—rack level liquid cooling loop extended to liquid-cooled external modular cooling unit and rack air-cooled components.
- 7.1 Electrical Power Distribution Equipment
- 7.2 Battery Plants
- 7.2.1 Secondary Battery Plants
- 7.2.2 Vented Lead-Acid (VLA) batteries
- 7.2.3 Valve Regulated Lead-Acid (VRLA) Batteries
- 7.2.4 Battery Rooms
- 7.3 Engine/Generator Rooms
- 7.4 Burn-In Rooms and Test Labs
- 7.5 Datacom Equipment Spare Parts
- 7.6 Storage Spaces
- Figure 7.1 Typical electrical power distribution equipment block diagram.
- 8.1 Introduction
- 8.2 Contamination Classifications
- 8.2.1 Gases
- Table 8.1 Characteristics of Corrosion Initiating Gases
- 8.2.2 Solids
- 8.2.3 Liquids
- 8.3 Industry-Defined Limits and Test Methods for Contamination in IT Equipment Rooms
- Table 8.2 Corrosive Gas and Volatile Organic Industry Limits
- Table 8.3 Telecommunication Particulate Contamination and Concentrations
- 8.4 Facilities Design—General Considerations for Data Processing Environment Installations
- 8.4.1 Site Selection
- 8.4.2 Construction
- 8.4.3 Fire Prevention
- 8.4.4 Raised-Floor Design
- 8.4.5 Overhead Supply Air
- 8.4.6 Ceiling Panels
- 8.4.7 Temperature and Humidity Control
- 8.4.8 Filtration
- Table 8.4 Comparison of ASHRAE 52.1 and 52.2 Standards
- 8.4.9 Positive Pressurization
- 8.4.10 IT Equipment Installation
- 8.4.11 Operational Strategies
- 8.4.12 Site Survey
- 8.5 Summary
- 9.1 Acoustics
- 9.2 ASHRAE Resources
- 9.3 Three Aspects of the Noise Problem: The Source, Path, and Receiver
- 9.4 The Effects of Noise on People
- 9.5 The Sound Power Level of a Noise Source
- 9.6 Limits on the Sound Power Levels of Datacom Equipment
- 9.7 The Sound Pressure Level in a Room
- 9.8 Limits on the Sound Pressure Levels in Datacom Facilities
- 10.1 Building Floor Structure
- 10.1.1 Weight Distribution Area
- 10.1.2 Floor Loading/Floor Load Rating
- 10.1.3 Floor Loading Calculation General Formulas
- 10.1.4 Floor Loading Calculation Examples
- Figure 10.1 Weight distribution area. Reproduced with permission from IBM (2001).
- 10.2 Access Floor Panels and Structure
- 10.2.1 Concentrated Load
- 10.2.2 Uniform Load
- 10.2.3 Ultimate Load
- 10.2.4 Rolling Load
- 10.2.5 Stringer vs. Stringerless Understructure Systems
- 10.2.6 Floor Panel Load Ratings
- 10.2.7 Access Floors in Seismic Areas
- 10.3 Datacom Equipment Installation in an Earthquake area
- Figure 10.2 Rigid tie-down—turnbuckle assembly. Reproduced with permission from Notohardjono (2004).
- Figure 10.3 Rigid tie-down—detail turnbuckle assembly. Reproduced with permission from Notohardjono (2003).
- Figure 10.4 Overhead seismic rack snubber.
- 11.1 FIRE ALARM SYSTEMS
- 11.1.1 Fire Detection Methodologies: Types of Detectors and Applications
- 11.1.2 Applications of Smoke/Fire Detection Systems
- 11.1.3 Basic Functions
- 11.1.4 Notification Devices
- 11.1.5 Manually Actuated Pull Station
- 11.1.6 Identification
- 11.1.7 System Documentation
- 11.1.8 Inspection, Testing, and Maintenance
- 11.2 FIRE SUPPRESSION SYSTEMS
- 11.2.1 Clean Agent Systems
- 11.2.2 Water-Based Systems
- 11.2.3 Fire Standpipe Systems
- 11.3 FIRE BARRIER (FIRESTOP) APPLICATION
- 11.3.1 General
- 11.3.2 Firestop System Test Ratings
- 11.3.3 Firestop Materials
- 11.3.4 Penetration Types and Firestopping Applications
- 11.4 MECHANICAL VENTILATION SYSTEMS
- 11.4.1 Smoke Control Purge Systems
- 11.4.2 Fire Suppression Purge Systems
- 12.1 Introduction
- 12.2 Preliminary Documentation
- 12.3 Commissioning Levels
- 12.4 Commissioning Mission Critical Facilities
- 12.5 Commissioning Costs
- 12.6 Summary
- Table 12.1 Categories of Formal Commissioning Activities
- 13.1 Availability Definitions
- 13.2 Redundancy
- 13.3 Diversity
- 13.4 Human Error and Availability
- 13.5 Practical Examples
- 14.1 Introduction
- 14.2 Environmental Criteria
- 14.3 Chilled-Water Plants
- 14.3.1 Water Chillers
- 14.3.2 Chilled-Water Pumps
- 14.3.3 Condenser Water Pumps
- 14.3.4 Cooling Towers
- 14.3.5 Controls
- 14.3.6 System Simulation and Optimization
- 14.4 CRAC Units: Generation
- 14.5 Fans, Pumps, and Variable-Speed Drives
- 14.5.1 Fans
- 14.5.2 Pumps
- 14.5.3 Variable-Speed Drives
- 14.6 Humidity Control
- 14.6.1 Dehumidification
- 14.7 Water-side Economizers
- 14.8 Air-side Economizers
- 14.9 Outdoor Air Ventilation
- 14.10 Part-Load Operation—Generation
- 14.11 In-Room Airflow Distribution
- 14.12 CRAC Units—Distribution
- 14.13 Part-Load Operation—Distribution
- 14.14 Datacom Equipment Energy Usage
- 14.15 UPS Energy Efficiency
- 14.16 Emerging Technologies
- 14.17 Controls and Energy Management
- 14.18 System Energy Simulation
- Figure 14.1 Direct water-side economizer.
- Figure 14.2 Indirect water-side economizer.
- Figure 14.3 Air-side economizer schematic.
- Figure A.2 Inlet and component temperatures with fixed fan speed.
- Figure A.3 Inlet and component temperatures with variable fan speed.
- Figure A.1 2008 recommended environmental envelope (new Class 1 and 2). [Go to Page]