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ASHRAE Datacom Equipment Power Trends and Cooling Applications, 2nd Edition, 2012
- Datacom Equipment Power Trends and Cooling Applications, Second Edition
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- Contents
- Foreword
- Preface
- Acknowledgments
- Chapter 1—Introduction
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- 1.1 Purpose/Objective
- Chapter 2—Background
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- 2.1 Datacom Facility Planning
- Table 2.1 Datacom Computer Room Area Breakdown Example
- Figure 2.1 Datacom computer room area allocation example.
- 2.2 Simple Example of Datacom Equipment Growth Impact on a Facility
- Table 2.2 5000 ft² (465 m²) Datacom Equipment Room Breakdown—Current Chilled-Water Cooling Load
- Table 2.3 5000 ft² (465 m²) Datacom Equipment Room Breakdown— Anticipated Chilled-Water Cooling Load
- Figure 2.2 Power density comparisons for two scenarios of data center growth.
- 2.3 Overview of Power Density Definitions
- 2.4 IT and Facility Industry Collaboration
- 2.5 IT Industry Background
- Chapter 3—Component Power Trends
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- 3.1 Introduction
- 3.2 Servers and Their Components
- Figure 3.1 Processor.
- Figure 3.2 1U server processor heat sink.
- Figure 3.3 Typical dual in-line memory module (DIMM) with and without a heat spreader.
- Figure 3.4 Typical dual-socket motherboard.
- Figure 3.5 Typical compute server rack and packaging.
- Figure 3.6 Example blade.
- Figure 3.7 Example blade server chassis.
- Figure 3.8 ASHRAE definitions for rack airflow.
- 3.3 Server Power Distribution
- Figure 3.9 Example of power consumption within a server.
- 3.4 Component Power Trends
- Figure 3.10 Individual processor power trend.
- Figure 3.11 Server memory power trend.
- Figure 3.12 Large number of smaller cores in an MIC processor.
- Figure 3.13 GPU with associated advanced thermal solution.
- Figure 3.14 Typical HDD subcomponent view.
- Figure 3.15 Enterprise HDD (LFF 7200 rpm) operating power and power efficiency trend.
- Figure 3.16 Enterprise HDD (SFF 10K rpm) operating power and power efficiency trend.
- Figure 3.17 Peripheral component interconnect (PCI) express solid-state storage card.
- Figure 3.18 Enterprise NVM storage power planning guide.
- 3.5 Power Supplies
- Figure 3.19 Example power supply efficiencies.
- Figure 3.20 Power supply efficiency improvement example.
- Chapter 4—Load Trends and Their Applications
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- 4.1 Introduction—ASHRAE Updated and Expanded Air-Cooling Power Trends
- 4.2 Definition of Watts per Equipment Square Foot Metric
- Figure 4.1 Graphical representation of width × depth measurements used for equipment area definitions.
- Figure 4.2 The 2005 ASHRAE power trend chart.
- 4.3 The 2005 ASHRAE POWER Trend Chart
- 4.4 POWER Trend Chart Evolution
- 4.5 Volume Servers
- Figure 4.3 2005 ASHRAE power trend chart for compute servers.
- Figure 4.4 1U servers—2005 and 2012 trends.
- Figure 4.5 2U servers—2005 and 2012 trends.
- Figure 4.6 4U servers—2005 and 2012 trends.
- 4.6 Idle Power For Servers
- Figure 4.7 Blade servers (7U, 9U, and 10U)—2005 and 2012 trends.
- Table 4.1 Volume Server Power Trends
- Table 4.2 Power Trends of Nonstandard-Planform Equipment
- Figure 4.8 SpecPower trend in idle power.
- Table 4.3 Idle Power Technologies
- Figure 4.9 PSU efficiency trends.
- 4.7 ASHRAE Liquid-Cooling Power Trends
- Figure 4.10 Liquid-cooled rack power trends.
- 4.8 Product Cycle vs. Building Life Cycle
- 4.9 Predicting Future Loads
- 4.10 Provisioning For Future Loads
- Chapter 5—Air Cooling of Computer Equipment
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- 5.1 Introduction
- 5.2 Air Cooling Overview
- Figure 5.1 Hot aisle/cold aisle cooling principle.
- 5.3 Underfloor Distribution
- Figure 5.2 Raised-floor implementation most commonly found in data centers using CRAC units.
- 5.4 Overhead Distribution
- Figure 5.3 Raised-floor implementation using building air from a central plant.
- Figure 5.4 Raised-floor implementation using two-story configuration with CRAC units on the lower floor.
- Figure 5.5 Overhead cooling distribution commonly found in central office environments.
- 5.5 Managing Supply and Return Airflows
- Figure 5.6 Raised-floor implementation using a dropped ceiling as a hot air return plenum.
- Figure 5.7 Raised-floor implementation using panels to limit hot aisle/ cold aisle “mixing” by containing the cold aisle supply.
- Figure 5.8 Raised-floor implementation using panels to limit hot aisle/ cold aisle “mixing” by containing the hot aisle exhaust.
- Figure 5.9 Raised-floor implementation using inlet and outlet plenums/ ducts integral to the rack.
- Figure 5.10 Raised-floor implementation using outlet plenums/ducts integral to the rack
- 5.6 Local Distribution
- Figure 5.11 Local cooling distribution using overhead cooling units mounted to the ceiling.
- Figure 5.12 Local cooling distribution using overhead cooling units mounted to the ceiling of the hot aisle.
- Figure 5.13 Local cooling distribution using overhead cooling units mounted to the tops of racks.
- Figure 5.14 Local cooling via integral rack cooling units on the exhaust side of the rack.
- Figure 5.15 Local cooling via integral rack cooling units on the inlet side of the rack.
- Figure 5.16 Local cooling units interspersed within a row of racks.
- 5.7 Air-Cooling Equipment
- 5.8 Air-Cooling Controls
- 5.9 Reliability
- Chapter 6—Liquid Cooling of Computer Equipment
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- 6.1 Introduction
- 6.2 Liquid Cooling Overview
- 6.3 Liquid-Cooled Computer Equipment
- Figure 6.1 Internal liquid-cooling loop exchanging heat with liquid-cooling loop external to racks.
- Figure 6.2 Internal liquid-cooling loop extended to liquid-cooled external modular cooling unit.
- Figure 6.3 Internal liquid-cooling loop restricted within rack.
- 6.4 Liquid Coolants for Computer Equipment
- 6.5 Datacom Facility Chilled-Water System
- Figure 6.4 Typical example of chilled-water loop and valve architecture.
- 6.6 Reliability
- Chapter 7—Practical Example of Trends to Data Center Design
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- 7.1 Introduction
- Table 7.1 Document Trend Chart Loads—Today and Future Refreshes— Watts per Chassis and Watts per Cabinet/Rack
- Table 7.2 Today and Future Refreshes—Server Types per Zone—Watts per Chassis and Watts per Cabinet/Rack
- Table 7.3 Establishing Current ITE Loads
- Table 7.4 Establishing the Adjustment Factor to be Applied to Trend Chart Loads
- Table 7.5 Today and Future Refreshes—Server Types per Zone—Adjusted Watts per Cabinet/Rack
- Appendix A—Glossary
- Appendix B—Additional Power Trend Chart Information/Data
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- Figure B.1 1U Servers—2005 and 2012 trends (SI units).
- Figure B.2 2U Servers—2005 and 2012 trends (SI units).
- Figure B.3 4U Servers—2005 and 2012 trends (SI units).
- Figure B.4 Blade servers (7U, 9U, and 10U)—2005 and 2012 trends (SI units).
- Figure B.5 1U Servers—2005 and 2012 trends (non-log scale, I-P units).
- Figure B.6 2U Servers—2005 and 2012 trends (non-log scale, I-P units).
- Figure B.7 4U Servers—2005 and 2012 trends (non-log scale, I-P units).
- Figure B.8 Blade servers (7U, 9U, and 10U)—2005 and 2012 trends (non- log scale, I-P units).
- Figure B.9 1U Servers—2005 and 2012 trends (non-log scale, SI units).
- Figure B.10 2U Servers—2005 and 2012 trends (non-log scale, SI units).
- Figure B.11 4U Servers—2005 and 2012 trends (non-log scale, SI units).
- Figure B.12 Blade servers (7U, 9U, and 10U)—2005 and 2012 trends (non- log scale, SI units).
- Appendix C—Electronics, Semiconductors, Microprocessors, ITRS
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- C.1 Cost-Performance Processors
- Figure C.1 Cost-performance die size.
- Figure C.2 Cost-performance power density.
- Figure C.3 Cost-performance maximum power.
- Figure C.4 Cost-performance junction temperatures.
- Figure C.5 Cost-performance thermal resistance.
- C.2 High-Performance Processors
- Figure C.6 High-performance die size.
- Figure C.7 High-performance power density.
- Figure C.8 High-performance maximum power.
- C.3 Post CMOS
- Figure C.9 High-performance junction temperature.
- Figure C.10 High-performance thermal resistance.
- Table C.1 Post-CMOS Research Activities
- References [Go to Page]
- Bibliography
- Index
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